National Institute of Research and Development for Optoelectronics INOE 2000 - Coordinator (CO)

Spin coater for thin films deposition; PLD work station; Equipment for growth of volume mono-crystals (TDK); Thermal treatment furnace L1206 M (CALORIS, Romania); Experimental set-up for magneto optical analysis (Kerr effect); Experimental set up for Seeback coefficient (studying of charge and heat transport in semiconductor nanostructures); Experimental set up for luminescence measurements (Andor, Shamroch spectrograph, CCD detector); FT-IR spectrophotometer  (Perkin Elmer, Spectrum 100); micro Raman spectrometer (Horiba-Jobin Yvon, LABRAM HR 800); UV-Vis spectrophotometer (Perkin Elmer, Lambda 1050); Ellipsometer (Horiba Jobin Yvon, UVISEL).

 

S.C.Sitex S.RL. (P2)

 

Furnace for thermal treatment with controlled environment MEV; Sintering furnace high temperature (UK); Spinner Delta 10 TT (Suss MicroTec); Vacuum deposition; Microwave soldering station; Vertical laminar flow VLF; Orizontal laminar flow  HLF; Thin films measurement Thaly-step “TAYLOR-HOBSON”; Metallographic microscope; Photometer/radiometer; Caracterograph Tectronix 576; Oscilloscope Tektronix 466; Pulse generator Wavetek; Resistivity measurement equipment FOXBORO; Interpherometer ZYGO  PM2; AC/DC supply source; Elipsometer GSS; Pick and place EPE Technology 20/20; Oscilloscope Tektronix 467; Ultrapure water system Centra R 200.

 

New University of Lisbon, Faculty of Science and Technology-I3N/CENIMAT (P3) 

X-ray Diffractometer (Rigaku, DMAX-III C); X-ray Diffractometer rotative anode + (AXS-Bruker, D5000); High/Low Temperature chamber for in situ XRD (Anton Paar, TTK 450);
Sequential X-Ray Fluorescence spectrometer (WDXRF, PANalytical, Axios); Scanning Electron Microscope (ZEISS, DSM 960); EDS (Oxford Instruments INCAx-sight); Inverted optical microscope (Leica, DMI 5000 M); Differential Scanning Calorimeter (SETARAM, DSC 92); Horizontal and muffle furnaces (up to 1600 ºC); He-pycnometer (Micromeritics, Accupyc 1330); IR Spectrometer (Mattson, 7000 FT-IR ); UV-VIS-NIR double beam spectrometer (Shimadzu, UV3100PC); Keithley 617 Model Programmable Electrometer.

 

ARTEOS GMBH (P4)

Wire bonding machine; Nd: YAG Laser for welding with equipment and devices for micro welding; Diode laser for soldering with equipment and devices for micro soldering; Tungsten-inert gas welding with several equipment & devices for micro soldering; He leak detector; Micro assembly places manually operated with stereo-microscope; Micro assembly places manually operated with video camera, micro positioned; Laboratory microscopes, magnification until 1000 times; Micro assambly machine automatic; H₂ micro welding place for hard soldering; electronic laboratory with all electronic test equipment; Optical laboratory with test equipment and optical work bench; Surface mounted devices (SMD) production line; Laboratory for assembly nanocomponents with nano-micro-integration approach; Gas test place for adjustment of gas sensors; Test place for adjustment of micro flow sensors; Test place for adjustment of pressure sensors; Ceramic packing place; Glass packing place; Plasma cleaning and etching machine; Micro soldering place with UV-light for UV-soldering; Electric heater up to 1500 °C; Cleanroom; Milling machine, conventional; Milling machine, CNC; Turning machine; Drilling machine.

 

 

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